{"id":1739,"date":"2018-05-31T09:52:52","date_gmt":"2018-05-31T09:52:52","guid":{"rendered":"https:\/\/athis-consulting.com\/news\/?p=1739"},"modified":"2018-06-15T08:02:01","modified_gmt":"2018-06-15T08:02:01","slug":"imec-demos-cost-effective-cooling-solution-for-high-performance-chips","status":"publish","type":"post","link":"https:\/\/athis-technologies.com\/news\/innovation\/wireless-telecom\/2018\/imec-demos-cost-effective-cooling-solution-for-high-performance-chips\/","title":{"rendered":"Imec Demos Cost-Effective Cooling Solution for High Performance Chips"},"content":{"rendered":"<p>Imec announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.\u00a0 This achievement is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems.<\/p>\n<p>High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that create a fixed thermal resistance that can\u2019t be overcome by introducing more efficient cooling solutions. Direct cooling on the chip backside would be more efficient, but current direct cooling microchannel solutions create a temperature gradient across the chip surface.<\/p>\n<p><a href=\"https:\/\/www.imec-int.com\/en\/articles\/imec-demonstrates-efficient-cost-effective-cooling-solution-for-high-performance-chips\" target=\"_blank\" rel=\"noopener\">Full Article<\/a><\/p>\n<p>Source:\u00a0<a href=\"https:\/\/www.imec-int.com\" target=\"_blank\" rel=\"noopener\">https:\/\/www.imec-int.com<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Imec announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.\u00a0 This achievement is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems. High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":1743,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"amp_status":"","_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","enabled":false}}},"categories":[11],"tags":[],"jetpack_publicize_connections":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v22.8 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Imec Demos Cost-Effective Cooling Solution for High Performance Chips - AthisNews<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/athis-technologies.com\/news\/innovation\/wireless-telecom\/2018\/imec-demos-cost-effective-cooling-solution-for-high-performance-chips\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Imec Demos Cost-Effective Cooling Solution for High Performance Chips - AthisNews\" \/>\n<meta property=\"og:description\" content=\"Imec announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.\u00a0 This achievement is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems. High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/athis-technologies.com\/news\/innovation\/wireless-telecom\/2018\/imec-demos-cost-effective-cooling-solution-for-high-performance-chips\/\" \/>\n<meta property=\"og:site_name\" content=\"AthisNews\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/AthisNews-271175647014395\/\" \/>\n<meta property=\"article:author\" content=\"https:\/\/www.facebook.com\/AthisNews-271175647014395\/\" \/>\n<meta property=\"article:published_time\" content=\"2018-05-31T09:52:52+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2018-06-15T08:02:01+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/athis-technologies.com\/news\/wp-content\/uploads\/2018\/06\/3D-Printed-Fluidic-Cooler001_rescaled1400x720.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1400\" \/>\n\t<meta property=\"og:image:height\" content=\"700\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Thomas Madjour\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@https:\/\/twitter.com\/thomasmadjour\" \/>\n<meta name=\"twitter:site\" content=\"@Athis_News\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Thomas Madjour\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/athis-technologies.com\/news\/innovation\/wireless-telecom\/2018\/imec-demos-cost-effective-cooling-solution-for-high-performance-chips\/\",\"url\":\"https:\/\/athis-technologies.com\/news\/innovation\/wireless-telecom\/2018\/imec-demos-cost-effective-cooling-solution-for-high-performance-chips\/\",\"name\":\"Imec Demos Cost-Effective Cooling Solution for High Performance Chips - 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