Imec announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level. This achievement is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems.
High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that create a fixed thermal resistance that can’t be overcome by introducing more efficient cooling solutions. Direct cooling on the chip backside would be more efficient, but current direct cooling microchannel solutions create a temperature gradient across the chip surface.
Source: https://www.imec-int.com