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Perspective: New process technologies required for future devices and scaling

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Robert D. Clark and his coauthors worked in an deep study which is an invited perspective on the new process technologies that will need to be developed in order to enable future semiconductor device scaling. It’s in the most recent issue of APL Materials.

This paper presents an overview and perspective on processing technologies required for continued scaling of leading edge and emerging semiconductor devices. They introduce the main drivers and trends affecting future semiconductor device scaling and provide examples of emerging devices and architectures that may be implemented within the next 10-20 yr. They summarize multiple active areas of research to explain how future thin film deposition, etch, and patterning technologies can enable 3D (vertical) power, performance, area, and cost scaling. Emerging and new process technologies will be required to enable improved contacts, scaled and future devices and interconnects, monolithic 3D integration, and new computing architectures. These process technologies are explained and discussed with a focus on opportunities for continued improvement and innovation.

Full Article

Source: https://aip.scitation.org

Featured Image credit: steve curd